Fabric over foam
Fabric over foam, composed of a conductive layer and a foam core, can be processed into various shapes. The compressibility and resilience of foam core can meet the requirement for low closing force, so that it is widely applied to EMI shielding requirement for the gap between electronic device housing and cabinet. There is also all-round conductive foam (3D conductive foam), which has better mechanical properties than traditional FOF and can be punched into different shapes.
Characteristics and advantages
● With low resistance and high resilience, it can meet multiple opening and closing or plugging applications, providing stable grounding or shielding performance
● Low resilience, no excessive pressure on equipment stress.
Tablet and laptop